GP-L700-462H is a Autofocus Long Working Distance Metallurgical Microscope. It is equipped with long-working-distance objectives and bright-field observation mode. Extra internal working-distance space accommodates height-difference samples. 4K high-definition imaging delivers sharp microstructure and surface-defect details. The trinocular port supports camera-module and image-analysis-software upgrade. Widely used in university research institutes and industrial QC-laboratories for micro-observation and quality-evaluation of metallic and non-metallic specimens.
This Autofocus Long Working Distance Metallurgical Microscope is suitable for inspection of precision components, integrated circuits and packaging-material products.
1. Magnification: 380-3800X four-speed high-magnification for grain-and-chip-micro-structure observation. Ordinary metallurgical microscopes deliver lower maximum magnification and blurry high-power images, and cannot observe ultra-fine metal grains.
2. Imaging System: Native 4K ultra-HD camera, synchronized eyepiece-and-monitor viewing. Ordinary metallurgical microscopes use low-definition 2K-grade camera and only eyepiece-viewing.
3. Measurement & Storage: Built-in on-monitor precise-measurement with photo-video-capture for test-evidence-archiving. Ordinary metallurgical microscopes have no onboard-measurement and require PC-software for all measurement-and-archiving work.
4. Application Range: Optimized for precise inspection of wafers, semiconductor chips and metal grains. Ordinary metallurgical microscopes are limited to simple metal-slice observation with poor performance for fine chip-grade specimens.
4K camera integrated with trinocular head for simultaneous viewing via eyepieces and monitor. Multi-port output via HDMI, USB3.0 and WIFI transmits ultra-HD micro-images in real-time.
Precision multi-layer lens optical-path with four-step magnification; max digital magnification up to 3800X, capturing sharp micron-level micro-structures of wafers, chips and crystal grains.
Built-in hardware auto-focus module; manual-focus mode is also available. Delivers stable, vibration-free focusing and improves inspection efficiency for mass-sample-testing.
Thickened square metal base with solid support-arm lowers center-of-gravity, avoiding shifting/shaking during long-hour continuous high-power observation.
Rigid black-and-white metal body with detachable split light-source module, minimalist professional styling for labs and semiconductor workshops.
Optimized for wafer-and-chip inspection; also widely applied for semiconductor-testing, metallographic-analysis, material-research and industrial-quality-control work.
4K photo & video capture, dual-measurement modes (on-screen built-in + PC-software). Dual-storage via U-disk & computer. Depth-of-field synthesis runs both on-monitor and PC-software; image-stitching available only in PC-software. Secondary-development supported for image archiving, comparison and advanced-analysis.
Mechanics: Full-metal construction for high rigidity and vibration resistance. Extra-long working-distance for tall-height-sample observation. Hardware auto-focus module equipped, manual-focus mode also available. Precision coarse-fine focusing without backlash. Wear-resistant manual XY mechanical stage. Trinocular optical path maintains optical co-alignment when switching objectives.
Optics: Infinity-corrected plan-achromatic metallurgical objectives with anti-fog hard coating. Reflected-light 6V-30W halogen-lamp illumination.
Imaging & Measurement: 8.3-Megapixel 4K industrial CMOS camera. Multi-output: HDMI + USB3.0 + WIFI, good anti-interference performance for industrial-environment use. Supports embedded on-monitor measurement and PC-software measurement. Dual-path storage via U-disk and PC-software. Depth-of-field synthesis runs both on-monitor and PC-software; image-stitching supported exclusively by PC-software. Secondary-development interface available via USB3.0 / WIFI.
Operating Environment: Working temperature 10-35℃, relative humidity 30-75%RH. Stable under regular factory electromagnetic-environment. Avoid heavy vibration, corrosive gas and heavy dust. Keep WIFI module away from strong signal-interference sources.
Quality & Maintenance: Full-item factory inspection. Do not disassemble optical modules or auto-focus module. Regular dust-proof cleaning will extend service life.
Semiconductor & Microelectronics (Core Application):
Silicon wafers, lithography slices, IC chips, MOS tubes, PCBs, FPC flexible circuits, packaged solder joints.
Inspection targets: chip-surface-micro-circuit patterns, wafer-etching-defects, coating-scratches,
packaging-bubbles, cold-soldering-joints, oxidation and pin-deformation. Ultra-high magnification up to 3800X for
micron-scale chip-slice observation.
Metallographic Metal Specimens & Metal-Cutting-Tools:
Alloy metallographic sections, steel slices, precision-stamped metal hardware.
Inspection targets: metal-grain-structure, heat-treatment-metallographic-analysis, micro-surface-cracks,
cutting-edge-chipping, burrs, wear-traces and internal-material-impurities.
Laboratory Research Samples: Crystal, Powder & Thin-Film:
Single-/poly-crystals, metal powder, chemical powder, optical-coating-films, ultra-thin-film-materials.
Observe micro-crystal-lattices, ultra-fine-particle-morphology, film-delamination and micro-coating-textures.
Optoelectronic Precision-Plastic Components:
LED chips, optical-glass-lenses, semiconductor-packaging-glue.
Detect micro-pores, nano-scratches, glue-delamination, bubbles and subtle-surface-unevenness.
Miniature Precision Components:
Connectors, terminals, micro-springs, small precision-stamped-workpieces.
4K-pixel-level accurate measurement for gaps, hole-diameters, pitch and surface-height-differences; DIC visualizes
subtle crimp-deformation.
University Labs & High-End Semiconductor QC:
Material-research-experiments, metallurgy-teaching-analysis, incoming-and-finished-goods-wafer-sampling-inspection;
photo-video archiving, export precise-measurement QC-reports via PC.
Equipped with native 3840*2160 4K ultra-HD imaging. Suitable for wafer-metallographic-inspection and metal-material-analysis; clearly shows grain textures, micro-scratches and tiny micro-defects.
Hardware auto-focus equipped for mass-production-inspection and frequent-sample-replacement. Fast focusing after moving work-pieces without repeated manual adjustment to boost efficiency. Manual-focus mode also available for static-sample observation.
Independent split coaxial light-source for metal specimens, wafers and reflective PCBs. Vertical coaxial lighting suppresses metal reflective glare and restores real metallographic textures. Motor-driven XY stage can be selected as optional upgrade.
Dual-magnification-range: 50-500X optical magnification, 380-3800X digital magnification. Covers both full-specimen overview and micro-grain / micro-defect inspection.
Supports built-in on-device measurement and PC-software measurement. Equipped with HDMI, USB3.0 and WIFI output ports. Photos, videos and measurement-data can be saved via compliant U-disk or computer. Secondary-development supported for production-line integration and lab-data-traceability.
Neutral-packing shipment is available upon request.
| Item | Description |
| Product Model | GP-L700-462H Long Working Distance Metallurgical Auto-Focus Microscope |
| Product Category | High-magnification research-grade vertical metallurgical microscope |
| Core Technologies | Trinocular synchronous-viewing optical system, split coaxial vertical light-source module, high-resolution metallurgical objective-lens set, 4K ultra-HD CMOS image sensor, hardware auto-focus system, triple-channel transmission (HDMI+USB3.0+WIFI), dual-measurement system, depth-of-field synthesis & image-stitching algorithm, open-architecture supporting secondary-development integration |
| Key Specifications | Optical magnification: 50/100/200/500×; Electronic magnification: 380/760/1520/3800×; Triple-output ports: HDMI + USB3.0 + WIFI; 4K capture resolution: 3840×2160; Hardware auto-focus equipped (manual-focus also available); Dual-measurement modes: built-in precise measurement + matched PC-software measurement; Dual-storage modes: U-disk storage + computer-software storage; Monitor terminal supports dimensional measurement, HD image preview, photo-video recording, depth-of-field synthesis; PC terminal supports dimensional measurement, file storage, depth-of-field synthesis and image-stitching; Whole-unit supports secondary-development integration. |
| Typical Application Scenarios | Wafer-chip-grain observation, semiconductor-packaging micro-defect-inspection, metal-material metallographic-analysis, precision-circuit micro-defect-detection, electronic-component-failure-analysis, advanced-material-laboratory-research |
| Manufacturer | Kunshan Gaopin Precision Instrument Co., Ltd. |
| Factory Location | Kunshan City, Jiangsu Province, China (adjacent to Shanghai) |
| Model | GP-L700-462H |
| Resolution | 3840×2160 |
| Real Effective Pixels | 8,300,000 pixels |
| Focusing Method | Autofocus |
| Optical Format | 1/1.8" |
| Pixel Size | 2.0 μm × 2.0 μm |
| Output Method | HDMI + USB3.0 + WIFI |
| Detailed functional introductions corresponding to each output interface |
① HDMI connects to 4K-compatible displays. Embedded professional image-processing firmware supports
hardware-driven auto-focus, photo-recording, video-recording, dimensional measurement, image playback
and
image comparison, operated by mouse in real-time. ② USB 3.0 connects to computer, bundled with high-quality professional image-processing software for photo capture, dimensional measurement, depth-of-field fusion and image-stitching. ③ WIFI module connects to laptops or mobile devices; real-time image transmission, photography and storage via matching software. |
| Frame Rate |
HDMI: 60fps @3840×2160 USB3.0: 30fps @3840×2160; 60fps @1920×1080 WIFI: 30fps @3840×2160; 60fps @1920×1080 |
| Depth-of-Field Synthesis | Supported by both HDMI on-monitor firmware and PC-software |
| Image Stitching | Supported only on PC-software side |
| Measurement Method | Built-in on-monitor measurement system + PC-software measurement |
| Measurement Accuracy | 0.002-0.005 mm |
| Measurement Units | mm / μm / mil / inch (4 switchable units) |
| Measurement Tools | Length, angle, radian, circle, polygon, polyline, center-to-center distance, rectangle, annotation adding, automatic edge detection, scale bar and more |
| Storage Method | U-disk storage + PC-software storage |
| Display Language | Simplified Chinese / English (switchable) |
| Processor | ARM Cortex-A17 Quad-Core @ Max. 1.4 GHz main-control processor |
| Operating System | Independently-developed measurement firmware based on Linux 3.1 kernel |
| Image Naming | Automatic or manual naming available |
| Viewing Head | 30°-inclined hinge-type trinocular head; inter-pupillary adjustment range: 53-75 mm |
| Observation Modes | Bright-field / oblique illumination / simple polarization |
| Illumination System | Falling-light illumination system, 100-240V wide-voltage input, adjustable filament center, continuously-adjustable light intensity. |
| Stand |
① Shooting-type rack, coaxial coarse-fine focusing mechanism with locking and limiting devices;
fine-movement graduation value: 2 μm. Halogen-lamp reflected-light illumination. ② Bright-field reflector with variable aperture stop, field stop and color-filter switching unit. ③ Yellow, blue, green filters and frosted-glass sheet supplied for reflected-light optical path. |
| Mechanical Stage | Base dimension: 300 mm × 240 mm; Stage dimension: 185 mm × 140 mm; X-Y travel: 35 mm × 30 mm. Suitable for relatively high-height workpieces. |
| Light Source | 6V 30W halogen-lamp chamber (reflected light only). |
| Simple Polarization Function | Push-pull type polarizer and analyzer installed |
| Electronic Interface | 1X C-mount camera interface, non-adjustable focus; CTV 0.5X is optional with price-difference compensation. |
| Eyepieces | Two WF10X/22 mm wide-angle plan-field eyepieces with individual diopter adjustment |
| Nosepiece | ★Mingchang five-hole objective nosepiece |
| Metallurgical Objectives |
★Infinity-corrected plan-achromatic metallurgical objectives ① PL L5X/0.12, Working Distance: 26.1 mm ×1pc ② PL L10X/0.25, Working Distance: 20.2 mm ×1pc ③ PL L20X/0.40, Working Distance: 8.80 mm ×1pc ④ PL L50X/0.70, Working Distance: 3.68 mm ×1pc ⑤ PL L100X/0.85, Working Distance: 0.40 mm (optional, not included in standard package) |
| Optical Magnification | 50X, 100X, 200X, 500X (four-level switchable) |
| Electronic Magnification | Approx. 380X, 760X, 1520X, 3800X (four-level switchable); optional magnification range: 190-1900X. |
GAOPIN microscopes are used by leading enterprises, research institutes, and universities. Our collaborative relationships include:
Zhejiang Maitong Intelligent Manufacturing Technology Co., Ltd. – Microscopic dimensional-inspection for automated precision-machined parts
Jiangsu Bigao Electromechanical Equipment Co., Ltd. – Dimensional & micro-flaw-detection for precision-machined parts
Tianjin University of Commerce – Material-laboratory-teaching, micro-imaging & experimental-data-archiving
Fudan University – Micro-nano-materials & biomedical microscopic-observation-research
Shanghai Institute of Ceramics, CAS – Micro-analysis of inorganic-ceramics & new-energy-materials
DOOV – Mobile-device-assembly-inspection, screen & component-appearance-testing
Kunshan Gaopin Precision Instrument Co., Ltd. was formally founded in 2011. Our founding-team accumulated rich optical-inspection-instrument-industry-experience starting in 2005. We deliver full-cycle-services covering optical-design, independent-R&D, global-sales and comprehensive-after-sales-maintenance-services. Our highly-skilled engineering-group has more than ten-years of hands-on optical-instrument-development-experience to deliver proven-stable-technology and dependable-product-quality.
GAOPIN maintains broad-ranging optical-product-portfolio with more than one-hundred inspection-oriented instruments serving industrial-and-laboratory-clients worldwide. We develop flexible, cost-effective customized microscopy-solutions to match diverse-industrial-testing-goals.
Rapid worldwide-technical-assistance is provided for overseas-partners including virtual-online-discussions, practical- video-walk-throughs and live-remote-operator-training. Our manufacturing-premises are located in Kunshan, Jiangsu Province (close to Shanghai). On-site-factory-visits and virtual-online-tours are warmly welcomed. Please contact our sales-team for authentic-sample-testing-photos captured by this Long Working Distance Metallurgical Auto-Focus Microscope to evaluate real-imaging-capability.
A1: Equipped with HDMI, USB3.0 and WIFI interfaces. It supports standalone monitor-operation or wired / wireless PC collaborative-detection.
A2: It supports 4K ultra-HD photo and video recording. Files can be saved to FAT32-formatted U-disk within 32 GB capacity or computer-storage. Supports both on-screen and PC-software precise-measurement, including dimension-marking, data-archiving and report-export functions.
A3: Check power-supply and matching adapter; fasten HDMI cable firmly and switch monitor to correct signal source; restart device to resolve black-screen, no-image and screen-flickering-faults.
A4: This model supports hardware auto-focus and manual-focus dual-modes. Enable auto-focus for fast imaging or fine-tune manually. Lock objective lens firmly, lay sample flat and regularly clean lens dust and fingerprints for sharp imaging.
Address
Building 2, Shuanglian International Business Center, Huaqiao Town, Kunshan City, China
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